| Manufacturing Process: | Electroplating |
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| Shape: | Circle, Cup, Dish, Cylindricality, Bowl Shaped |
| Bonding Agent: | Resin Bond Diamond or Ceramic Bond Diamond |
| Working Style: | Surface Grinding |
| Application: | Tungsten and Carbon Alloy |
| Payment: | Payple, T/T, C/L |
| Samples: |
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| Customization: |
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