Product Description
Bosdi's Silicon carbide polishing fluid is used for precision grinding and polishing of silicon carbide chips and other materials. This product is paired with a specialized silicon carbide polishing pad to improve efficiency and the surface quality of silicon carbide chips after precision grinding is high (roughness, scratches, subsurface damage layer,etc.). Silicone Carbide has a water soluble carrier formula which possesses a good cleaning performance.The product has good suspension stability an dwhen compared to conventional water-based formulas, the product has better lubrication performance.
Note: Customization can be made according to customer requirements
Characteristics of Product:1. Many kinds of abrasives are available such as polycrystalline diamond, monocrystalline diamond and nano diamond.
2. It has strict technical control which ennsures the consistency of the quality.
3. Suitable viscosity can meet all the different ways of of feeding such as dropwise and spraying.
4. Product has good suspension and dispersibility which make it easier to shake before use.
5. Excxellent removal rate.
6. Good cleaning property.
Main applications:
It is mainly used for the precision lapping and polishing of sapphire wafers, semiconductor materials, compound crystal, hard alloy, stainl;ess steel, ceramic materials and gems. if collocating with suitable lapping plate and polishing pad, it can achieve ideal removal efficiency and good surface effect. The product is also uised for grinding and polishiong silicon carbide chips and other materials that were mentioned above.
| Product Type |
Particle Size |
Abrasive Type |
Properties |
| BSD-SIC |
D50=2-4 μm |
Poly/ Polycrystalline-like diamond |
Stable Suspension ,
Water-based carrier |
| D50=0-1μm |
Poly/ Polycrystalline-like diamond |
Stable Suspension ,
Water-based carrier |
| D50=2-4 μm |
Polycrystalline-like diamond |
Stable Suspension ,
Water-based carrier |
Audited Supplier 
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