Pemium Quality Lapping Disc for Semiconductors

Product Details
Customization: Available
Material: Diamond
Abrasive: Natural Abrasives
Manufacturer/Factory, Trading Company, Other
Gold Member Since 2019

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  • Pemium Quality Lapping Disc for Semiconductors
  • Pemium Quality Lapping Disc for Semiconductors
  • Pemium Quality Lapping Disc for Semiconductors
  • Pemium Quality Lapping Disc for Semiconductors
  • Pemium Quality Lapping Disc for Semiconductors
  • Pemium Quality Lapping Disc for Semiconductors
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Basic Info.

Model NO.
Flat
Shapes
Round Disc
Types
Polishing Pads
Grain Size
20 Micron
Cylindricity
<1
Working Style
Polishing
Transport Package
Carton
Specification
200mm-1220mm
Trademark
BOSDI
Origin
China
HS Code
6804219090
Production Capacity
500PCS/Day

Product Description

Product Description
A lapping disc is a consolidated diamond lapping tool with special structure. It is
prepared by uniformly dispersing diamond powder in organic resin adhesive. It is
suitable for processing a variety of hard and brittle materials such as glass, ceramics
and semiconductor substrates.
1.The diamond powder with independent property right of our company is adopted,
which has round shape and small cutting edge, so it is not easy to cause deep
scratches to the processed workpieces.
2. The advanced technology can produce regular three-dimensional structure. The
multi-layer polishing particles in the three-dimensional structure are evenly
distributed, which can fall off layer by layer during the lapping process, and
maintain excellent "self-sharpening", and the processing efficiency is high and
stable, which can greatly shorten the processing time.
3. Matching with the coolant, there is no need to add additional polishing slurry, and
the production environment is clean.
4. Compatible with the mainstream single-sided and double-sided polishing
equipment in the market.
 

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